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[Analysis Case] Evaluation of Bonding State and Film Thickness of SiC Surface

In addition to detailed condition assessment, film thickness calculation is possible.

XPS can evaluate the chemical bonding state of the sample surface, and further detailed assessments can be made through waveform analysis. Additionally, by using assumed parameters in the waveform analysis results, it is also possible to calculate the thickness of surface oxide films, etc. In this document, we will introduce a case where the composition and state evaluation of the SiC surface was performed, along with the calculation of the oxide film thickness from the obtained peak intensity.

• Company：一般財団法人材料科学技術振興財団　MST
• Price：Other

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