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[Analysis Case] Evaluation of Bonding State and Film Thickness of SiC Surface

[Analysis Case] Evaluation of Bonding State and Film Thickness of SiC Surface

In addition to detailed condition assessment, film thickness calculation is possible.

XPS can evaluate the chemical bonding state of the sample surface, and further detailed assessments can be made through waveform analysis. Additionally, by using assumed parameters in the waveform analysis results, it is also possible to calculate the thickness of surface oxide films, etc. In this document, we will introduce a case where the composition and state evaluation of the SiC surface was performed, along with the calculation of the oxide film thickness from the obtained peak intensity.

  • Contract Analysis

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[Analysis Case] Depth Direction State Evaluation of Tin (Sn) Surface

[Analysis Case] Depth Direction State Evaluation of Tin (Sn) Surface

Evaluation of modified layers and altered layers through surface treatment is possible!

TOF-SIMS has good depth resolution and can obtain fragment ions corresponding to bonding states, allowing for the evaluation of layer structures near the surface, within a few nanometers. This document presents a case study analyzing the layer structure of a tin plate surface based on the information obtained from the measurement of standard samples of tin oxide and hydrated tin oxide. By applying this technology, it is possible to evaluate modified layers and altered layers due to surface treatment.

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  • Contract measurement
  • Contract Inspection

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